Specifications
PCB | Capability |
Layer Count | 2 - 32 Layers |
Max Working Panel Size | 585mmx515mm (23”x20.3” ) |
Min. Core Thickness | 0.06mm-1.60mm (2.4 mil-63 mil) |
Finished Board Thickness | 0.36mm-3.20mm (14 mil-128 mil) |
Inner Layer Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
Outer layer Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
Min. Drill Size for PTH(Mechanical) | 0.15mm (6 mil) |
Min. SMT Pitch | 0.38mm (15 mil) |
Max Aspect Ratio | 16:1 |
Solder Mask Registration Tolerance | ±0.05mm (±2 mil) |
Layer To Layer Registration | ±0.05mm (±2 mil) |
Routing Tolerance | ±0.15mm (±6 mil) |
Impedance Control Tolerance | 28Ω↑±10% |
Flex PCB | Capability |
Layer Count | 1 - 8 Layers |
Min. Line/Space Width | 0.075mm/0.075mm (3 mil/3 mil) |
Board thickness | 0.75mm-0.065mm (30 mil-2.5 mil) |
Min. Drill Size for PTH | 0.2mm (8 mil) |
Punching Tolerance Hard/Soft tooling | ±0.05mm/± 0.15mm ( ±2 mil/± 8 mil) |
Aspect Ratio | 4:1 |
Solder Mask Registration Tolerance | ±0.075mm (±3 mil) |
Layer to Layer Registration Tolerance | ±0.05mm (±0.2 mil) |
Impedance Tolerance | ±10% |
Surface Finishing | PCB | Flex PCB |
HASL | Yes | Yes |
OSP | Yes | Yes |
Immersion Gold | Yes | Yes |
Immersion Silver | Yes | |
Immersion Tin | Yes | |
OSP + Carbon ink | Yes | |
Plating Gold | Yes | Yes |
Plating Tin | Yes |
Type of Raw Material | ||
FR4 | High TG | Halogen Free |
Aluminum based material | Copper based material | High frequency |
PTFE | Heavy Copper Foil | Paper phenolic plate |
BT | PI | Composite material |
PTFE+metal base |
Major Material Supplier | ||
SHENGYI TECHNOLOGY CO., LTD. |
ITEQ CORPORATION |
ISOLA GROUP |
KINGBOARD HOLDINGS LIMITED |
TAIYO INK |
ATOTECH |
MACDERMID ENTHONE INDUSTRIAL SOLUTIONS |
The Dow Chemical Company |
Ventec International Group |